Senior IC/MEMS Integration and Simulation Engineer

Що робити

• Own MEMS design and layout adjustments that reconcile the microbolometer pixel array with the fixed ROIC pad configuration.
• Match microbolometer pixel anchor points precisely to predefined ROIC pad locations, iterating layout across design revisions.
• Build and run FEA models of mechanical behavior, including residual stress and the structural integrity of suspended pixel structures.
• Simulate thermal behavior across the packaging cycle — die attach, curing, wire bonding, lid sealing — to flag stress or delamination risk before fabrication.
• Feed simulation results back into layout and process decisions, working closely with the MEMS/Semiconductor Processing Specialist and packaging partners.